New Energy Vehicles (NEVs)

Propelled by the recent drive towards developing of a low-carbon society, the global automotive market is rapidly shifting from traditional internal combustion engines (ICE) to battery-powered or hybrid electric vehicles (xEV).  This change in global powertrain technology has rapidly increased the demand for high-power density magnetic components to support these emerging designs.
These new and innovative designs can no longer be accommodated by a standard line of generic magnetic components. To satisfy our customers' specialized design requirements for input/output filters, buck/boost converters, and PFCs, Sumida provides highly optimized products focusing on package miniaturization, large current capability, and low power loss via the use of in-house and industry standard tools for 3D modelling, temperature analysis, magnetic analysis, EDA, etc.

Target EV Applications

There are three main target applications for custom high-power inductors used in EV or Hybrid electric vehicle electronics:

1. Input and Output filter stage magnetics that are used to block noise. These devices filter the EMI/RFI noise coming from the switching devices used in the on-board battery chargers (OBCs), the utility power lines, and the boost converters that charge the main battery via power generated by the electric vehicle itself.
2. Power Factor Correction (PFC) stage chokes. Here, the input voltage of the converter is optimized by improving the overall power factor of the power supply and boosting various input voltages to a constant voltage.
3. Resonant inductors used in the LLC resonant converter. This is an important inductive element used to tune the resonant frequency of the converter for the best possible conversion efficiency.

Provided Solutions

In order to meet the various custom magnetics component requirements from our customers, we offer a variety of magnetic core materials (Ferrite, Metal, Dust, Amorphous), wire types (Round Wire, Flat Wire, Multistrand/Litz Wire), and numerous insulating/thermal potting materials. We also provide flexible mechanical design support utilizing custom housing or case designs with optimized mounting/connection methods (SMD, THT, Solder, Welding, Busbar connection, etc.) specifically designed to meet our customers physical package and interface constraints.